At Fraunhofer IZM, we are at the forefront of innovation in the world of microintegration and advanced packaging technologies. With a passion for pushing the boundaries of electronics packaging and a commitment to enhancing reliability, we stand as a driving force in the global electronics industry.
As a part of the prestigious Fraunhofer Society, our institute, the Fraunhofer Institute for Reliability and Microintegration, brings decades of research excellence and a multidisciplinary approach to meet the complex challenges of modern electronics.
Our mission is to enable the electronics of tomorrow by developing cutting-edge solutions for integrated circuits and electronic systems. We work hand in hand with industry partners, research institutions, and governmental agencies to create a sustainable, connected, and efficient world.
Our expert team of scientists, engineers, and researchers is dedicated to the research and development of advanced packaging technologies, microintegration, and reliability testing. We take pride in our ability to turn theoretical concepts into practical, real-world applications. Our commitment to innovation is reflected in our extensive portfolio of patents and groundbreaking research projects.
With a focus on reducing the environmental impact of electronic devices, we are actively contributing to a greener and more sustainable future. Our expertise extends to various fields, from power electronics to optoelectronics, from MEMS and sensor systems to system-in-package (SiP) solutions.
At Fraunhofer IZM, we foster a culture of collaboration, excellence, and knowledge sharing. We are driven by the desire to solve complex challenges and provide our partners with solutions that redefine what’s possible in the electronics industry.
Join us on our journey as we continue to push the boundaries of microintegration and advanced packaging, paving the way for a brighter and more interconnected future.